Microscopic mechanism that initiates vacuum RF breakdown on copper · revision history

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Title
Microscopic mechanism that initiates vacuum RF breakdown on copper
Plain
Breakdowns start at small spots on a polished copper surface, but which process lights the spark (electrons pulled out by the field, crystal defects moving to the surface, local melting) is not agreed.
Precise
In Cu accelerating structures at 3-30 GHz, breakdown occurs at surface fields $eE_{s} \sim 2-3\,\mathrm{MeV}/\mathrm{cm}$, and Fowler-Nordheim fits of dark current give field-enhancement factors $\beta \sim 30-100$ although no protrusions of matching height are observed. Identify the sequence of processes (dislocation-driven surface roughening, field-emission heating of emitters, neutral evaporation, plasma ignition) that turns an intact surface into an arc, with a model that predicts the threshold field and its dependence on hardness and crystal structure of the metal.
Settled by
In-situ imaging of breakdown sites before and after the event together with a model that reproduces measured thresholds for at least two metals of different crystal structure.
Kind
phenomenon
Answer type
mechanism
References
(empty)
Literature status
open
Status note
(empty)
Posed since
(empty)